On March 11, Intel officially lifted the media embargo on its new Ultra 200S Refresh processors, with full retail availability set for March 26, 2026. The new CPUs continue to use the LGA 1851 socket, delivering full compatibility with existing 800-series chipset motherboards. For users already on the Intel Core Ultra 200S platform, that means a straightforward CPU upgrade without replacing the motherboard, significantly reducing both upgrade time and cost.
As one of Intel’s key partners, MAXSUN has already completed optimization and compatibility tuning for the new Intel Ultra 200S Refresh processors across its 800-series motherboard family, including both Z890 and B860 chipsets. Covering everything from flagship enthusiast platforms and mainstream gaming builds to practical office systems, MAXSUN’s latest boards combine solid hardware design with broad compatibility, making them an ideal match for Intel’s new-generation processors and allowing users across different budgets to tap into the platform’s performance gains with ease.
Whether for hardcore gamers chasing top-tier performance or mainstream users prioritizing stability and everyday practicality, MAXSUN’s 800-series lineup offers a suitable option. In the flagship segment, MAXSUN’s Z890 series arrives with multiple standout models that showcase high-end specifications and forward-looking design.
The MS-iCraft Z890 Vertex features cutting-edge design and performance, including an onboard smart display and overclocking-focused enhancements. It is equipped with two USB4® 40G ports, up to nine USB 10G ports, a PCIe 5.0 x16 graphics slot, and a PCIe 5.0 x4 M.2 slot. It also supports PCIe 5.0 lane bifurcation and includes two SFF-8654 4i expansion connectors, underlining its flagship credentials.
The MS-iCraft Z890 Arctic introduces a next-generation icy aesthetic, blending technology with the beauty of nature for a distinctive visual and performance experience. It offers two USB4® 40G ports, up to nine USB 10G ports, one SFF-8654 4i expansion connector, a PCIe 5.0 x16 graphics slot, and a PCIe 5.0 x4 M.2 slot, while also supporting PCIe 5.0 lane bifurcation. It stands out as a true dual-flagship in both looks and performance.
The MS-iCraft Z890 Pacific also includes an onboard smart display, giving users more room for customization. With two USB4® 40G ports, up to nine USB 10G ports, one SFF-8654 4i expansion connector, a PCIe 5.0 x16 graphics slot, and a PCIe 5.0 x4 M.2 slot, plus support for PCIe 5.0 lane bifurcation, it is positioned as another premium Z890 flagship choice.
For the mainstream performance market, MAXSUN’s B860 series is equally compelling. The iCraft B860M CROSS series includes two models: the MS-iCraft B860M CROSS PRO and MS-iCraft B860M CROSS. Both adopt a 245mm x 245mm Micro-ATX form factor, making them compatible with a wide range of chassis, especially white showcase builds and anime-inspired setups. Both models also fully support MAXSUN’s latest PTM UI BIOS.
The MS-iCraft B860M CROSS PRO comes equipped with MAXSUN’s signature smart display. Its 3.4-inch LED panel supports multiple display modes, including real-time system monitoring, personalized boot and shutdown screens, and desktop mirroring for synchronized custom visuals or video content. Through the companion software MAXSUN View, users can explore a wide range of display customization options.
Users who prefer the chibi-style CROSS theme can opt for the MS-iCraft B860M CROSS, which features a compact onboard LED display. Once powered on, the board presents an energetic blinking animation, adding extra personality to the build.
Compared with the previous generation, the MAXSUN iCraft B860M CROSS series also brings upgraded power delivery. Both boards feature a 16+1+1 phase design with 50A Dr.MOS for the CPU core, enabling them to handle processors such as the Intel® Core™ Ultra 9 285K with ease. They are also equipped with front and rear USB-C® connectivity, plus a rear USB4® 40G port supporting transfer speeds of up to 40Gbps for faster data transmission.
The MS-Terminator B860M WIFI remains one of the most popular mainstream products in the MAXSUN Terminator family. Built on a Micro-ATX layout, it continues the series’ signature contrast-color design, pairing a black PCB with silver-white thermal armor for a restrained yet distinctly tech-forward appearance. Large heatsinks cover the power delivery section, and high-quality thermal pads between the armor and MOS components help transfer heat quickly to ensure stable operation.
In terms of power delivery, the board adopts a 10+1+1 phase SPS design with intelligent SPS power management for efficient, stable regulation, allowing the processor to perform at its full potential. Even under full CPU load, it is designed to minimize stuttering and frame drops. For memory, it provides four DDR5 DIMM slots with dual-channel support, supports up to 192GB total capacity, and offers overclocking potential of up to 8800MHz (OC) for stronger and more stable memory performance. Combined with the memory optimizations of the new processor, the platform can significantly improve system read/write speeds and multitasking efficiency.
At the entry level, the MS-Challenger B860M-K offers a highly cost-effective solution. It provides 6+1+1 phase 50A Dr.MOS power delivery, two full-speed M.2 slots, two PCIe expansion slots, and up to 10 USB ports, including six USB 5G ports. With a practical and well-rounded feature set, it is fully capable of handling daily office work as well as light gaming.
From flagship to entry-level, MAXSUN’s complete 800-series motherboard lineup combines solid build quality, rich expansion options, and comprehensive compatibility to pair seamlessly with Intel’s new Ultra 200S Refresh processors. Existing 800-series users can upgrade directly to the new CPUs without changing motherboards, unlocking the full performance potential of the platform. Whether for esports gaming, professional content creation, or everyday office use, the result is a smoother and more efficient computing experience—and a new standard for hassle-free hardware upgrades.
If you want this rewritten into a more media-release tone or a sharper tech-news editorial style, I can do that next.




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