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MAXSUN to Showcase Cutting-Edge Tech at COMPUTEX 2025 Join Us to Explore the Future of AI Innovation

COMPUTEX 2025

TAIPEI, Taiwan — May 10, 2025 — MAXSUN today announced its participation in COMPUTEX 2025, one of the world’s premier technology exhibitions, set to take place May 20–23 at the Nangang International Exhibition Center in Taipei, Taiwan.

With this year’s theme, “AI Next,” COMPUTEX 2025 will gather global technology leaders to spotlight the next generation of AI-driven innovation. MAXSUN will showcase a powerful array of products, highlighting breakthroughs that bridge hardware development and real-world AI applications.

Exhibition Details:
May 20–23, 2025
Nangang International Exhibition Center, Taipei, Taiwan – Hall 1, Booth L1118 (4th Floor)

Star Lineup: A Full-Spectrum Hardware Showcase

This year, MAXSUN presents a comprehensive product portfolio—from enthusiast-grade consumer hardware to industry-level platforms. Featured products include:

  • MAXSUN Z890 and B860 series motherboards
  • MAXSUN Intel Arc B580 series graphics cards
  • MAXSUN GeForce RTX 50 series GPUs
  • MS-WorkStation W790 112L motherboard,

Built for high-performance workstations

MS-Q670M vPro motherboard, tailored for enterprise-grade deployments

These solutions are engineered for high performance, rock-solid stability, and broad scalability—ready for both DIY gamers and commercial integrators. Additional hardware debuts will be revealed exclusively at the booth.

Visitors will also have opportunities to engage with MAXSUN’s expert team, attend live product demos, and explore real-world AI application scenarios. Whether you’re a hardware enthusiast, a business buyer, or a media representative, MAXSUN’s presence at COMPUTEX 2025 promises a front-row view into the future of intelligent computing.

Visit Us. Experience the Future. Build It With Us.

MAXSUN warmly welcomes global partners, tech enthusiasts, and industry media to Booth L1118 at Nangang International Exhibition Center. Explore the products. Share the vision. Shape what comes next—together.

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